Here are four medical adhesives technologies highlighted in the May/June issue of MPMN:
|(Image courtesy of Dymax)|
1. Light-curable adhesives
Dymax’s light-curing Encompass technology combines the company’s patented See-Cure color-change and Ultra-Red fluorescing technologies in a single light-curable product. Among the adhesives Dymax (Torrington, CT) supplies to manufacturers of disposable medical devices is a catheter adhesive in its MD line that is curable by light-emitting diodes (LEDs) and formulated using both the company’s Ultra-Red fluorescing technology and its patented See-Cure technology. This adhesive, blue in the uncured state, turns colorless when fully cured; then, when inspected under low-intensity black light at a 365-nm wavelength, it fluoresces bright red so that confirmation of accurate placement on the catheter is easy to secure. The manufacturer’s line of solvent-free and USP Class VI– and ISO 10993–compliant biocompatible light curing adhesives is designed for fast curing and process efficiency in medical device assembly. They are compatible with gamma, EtO, and E-beam sterilization techniques.
2. Assembly adhesives
Two flexible instant adhesives developed by Henkel Corp. (Rocky Hill, CT), Loctite 4902 and Loctite 4903, offer elongations of 155% and 86%, respectively. They can provide high-strength bonds in seconds. As flexible as acrylic and urethane adhesives, both of these cyanoacrylate adhesives bond to plastics, rubbers, metals, and other substrates and offer ISO 10993–compatible biocompatibility. They are suited for use in the assembly of disposable medical devices. The one-part, low-viscosity adhesives flow easily onto any substrate and typically fix components to handling strength within 5 seconds. The more flexible version has a modulus of 57,900 psi, and that with 85% elongation exhibits a modulus of 78,100 psi. Both are designed for use on close-fitting, flexible parts and can easily bond dissimilar substrates, including plastics and elastomers. Primers are available to enhance bond strength on difficult-to-bond substrates.
|(Image courtesy of Innovations in Optics Inc.)|
3. UV-LED adhesive curing systems
Innovations in Optics Inc. (Woburn, MA ) has debuted its Aurora UV Classic Line Sources for industrial UV curing as used for the photopolymerization of adhesives, coatings, and sealants. The Aurora Classic’s patented optical design provides peak irradiance at a large working distance from the emitter window and ultra-uniform distribution in two dimensions. The system is suited for UV curing applications where machine frameworks or complicated part profiles prevent the UV-LED system from being mounted close to the cure surface. The system is available in five beam lengths from 4 to 24 in. and four standard UV-LED center wavelength options including 365, 385, 395, and 405 nm. The Aurora UV Classic Line Sources can operate under natural convection cooling. The option of a fan-cooling plenum to drive the line source up to a twofold increase in peak irradiance is also offered.
4. Light cure adhesive
Ellsworth Adhesives (Germantown, WI), a global distributor of adhesives, specialty chemicals, and dispensing equipment, offers Henkel Loctite 3211 for medical device applications such as needle bonding, collection reservoirs, and transducer housing assemblies. Loctite 3211 is a light curing acrylic adhesive that forms flexible joints quickly with minimal stress cracking. It is suited for use with glass, metal, polycarbonates, and thermoplastics. The flexibility of the Loctite 3211 enhances load bearing and shock absorbing characteristics of the bond area, while not inducing stress cracking under typical molded stress levels. Loctite 3211 cures rapidly to form flexible, transparent bonds when exposed to ultraviolet light or visible light of sufficient irradiance. The thixotropic nature of Loctite 3211 reduces the migration of liquid product after application to the substrate. Loctite 3211 is certified to ISO 10993.
|Refresh your medical device industry knowledge at MD&M East in New York City, June 9–11, 2015.|
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