As an innovative manufacturer, Avicenna™ bridges the technology-solution gap between customer ideas and customer products. Avicenna specializes in using both laser and mechanical energy combined with sophisticated automation to prototype, plan, and manufacture products made from a wide range of materials. Avicenna commits its organizational energy to serve as the catalyst that connects customers to their market success.
Avicenna Technology, Inc. - Laser Machining Services
Avicenna combines automation and laser energy to precisely machine components made of polymers and metals. Avicenna's unique capabilities have made it a leading provider of laser machining services to medical device designers and manufacturers.
Avicenna prides itself on its customer focus. Avicenna requires no financial commitment from potential customers during proof-of-concept. Once a product reaches maturity, Avicenna's assigns to it a Coordinator whose mission is to fulfill every customer requirement.
Avicenna conducts its ISO certified operations from a 30,000 square foot facility. Avicenna's 20 laser systems are located on separate floors within its facility, offering operational contingencies and ensuring business continuity.
Avicenna utilizes laser wavelengths ranging from the ultraviolet to the infrared to achieve its suite of machining services. These services include the marking, drilling, ablating and skiving of polymers such as Hytrel, polyimide, PEEK, polyurethane, Pebax, silicone, and Teflon; and the welding of metals such as copper, nickel, platinum, nitinol, and stainless steel.
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Laser Welding
Avicenna has tailored its laser welding processes to the "micro" level achieving sub .004" spot welds of disparate metals, attaching coils and electrodes to conductors and guide wires as small as .005" diameter.
Laser Marking
Avicenna laser marks materials that have proven difficult to mark with traditional printing methods. Avicenna's laser energy interacts with these polymers to produce a permanent mark within the material wall that will not smear, leech, or fade over time.
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Laser Drilling
Avicenna excels in drilling clean holes in polymer materials as different as Pebax, polyimide, PEEK, and Pellethane. Avicenna's drilled holes do not delaminate composite layers of material and are free of sharp burrs and raised lips.
Laser Ablating and Skiving
Laser ablating removes material by breaking the material's molecular bonds. Avicenna's laser ablation process involves no heat and does not burn or melt material. Avicenna's ablation removes polymer materials without discoloring or deforming adjacent areas and underlying substrates. Skiving is the term Avicenna uses to describe its process of ablating cylindrical pieces and tubes. Skiving can create sharp steps or soft transitions in a tube's outside diameter.
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